On June 25, the 15th Guanghua Engineering Science and Technology Award Ceremony was held in Beijing. Mao Junfa, President of Shenzhen University (SZU) and Academician of the Chinese Academy of Sciences, who has recently won the First Prize of the State Scientific and Technological Progress Award, has been honored with the 15th Guanghua Engineering Science and Technology Award.
Mao has long been engaged in research on engineering and technological issues related to integrated circuit packaging and integration. He has presided over numerous national projects including the 863 Program, 973 Program, Key Technologies R&D Program, as well as basic science center projects and innovative research groups funded by the National Natural Science Foundation of China. His systematic innovations have significantly contributed to advancing related technologies and applications. His research achievements have addressed key technical challenges in 3D packaging integration of RF electronics, enhancing the integration capability of RF electronics systems. These achievements have been applied in the development of national major equipment and model products. Mao has established methodologies for understanding the signal integrity of high-speed integrated circuit interconnections and proposed new technologies and structures to improve the performance of the interconnections, which have been widely adopted by renowned institutions both domestically and internationally. Leading the project "Key Technologies and Applications of RF System Design Automation", Mao recently won the First Prize of the 2023 State Scientific and Technological Progress Award. His seminal work on "RF Electronics System's 3D High-density Packaging Technology and Its Applications" was awarded the Second Prize of the 2012 State Scientific and Technological Progress Award. His contributions also include the development of "Miniaturized High-performance Microwave Passive Components and Antennas", which received the Second Prize of the 2008 State Technological Invention Award; the "Fundamental Research on Signal Integrity Issues in High-speed Circuit Systems", which was honored with the Second Prize of the 2004 National Natural Science Award; and the "RF Integrated Circuit EDA Key Technologies and Tools", which were selected as one of China's Top 10 Technology Trends in Higher Education in 2020. Additionally, Mao has been awarded the 3rd National Innovation Contest Award, the Ho Leung Ho Lee Foundation Science and Technology Innovation Award, and two second prizes for National Teaching Achievement Award. Mao's research outcomes contribute to the development of key equipment in China and drive product research and development across over 200 significant enterprises, including SMIC and Huawei. Additionally, the RF EDA software developed under his leadership is exported to multinational corporations such as Intel, Cadence, and IBM.
Mao Junfa, Vice President of the Chinese Institute of Electronics and an IEEE Fellow, is responsible for establishing and obtaining approval for the new "State Key Laboratory of Radio Frequency Heterogeneous Integration", and serves as its director. His team strives to make breakthroughs in heterogeneous integration technology, facilitating the shift from circuit-level integration to system-level integration in the post-Moore era, and contributing to the curve overtaking development of microelectronics technology in China.
